Start Date: 01/12/2022,
End Date: 30/11/2025
The project “Novel 3D heterogeneous integration for future miniaturized power RF Transceiver front ends” (POWERPACK) will develop disruptive technologies for miniaturised RF chips for high frequency and high-power operation, and will focus on miniaturisation and 3D integration. The outcome will be a reduction in transmission losses, and will result in two demonstrators. These demonstrators will operate in the X-Band and in the Ka-Band. The devices will allow for integration in platforms where the components will need to ever be smaller and lighter.
Principal Investigator
Scientific Staff
Technical Staff
Research Associates
Alumni
Funding
European Defence Agency (EDA / EDF)