The project “Novel 3D heterogeneous integration for future miniaturized power RF Transceiver front ends” (POWERPACK) will develop disruptive technologies for miniaturised RF chips for high frequency and high-power operation, and will focus on miniaturisation and 3D integration. The outcome will be a reduction in transmission losses, and will result in two demonstrators. These demonstrators will operate in the X-Band and in the Ka-Band. The devices will allow for integration in platforms where the components will need to ever be smaller and lighter.